{"id":1678,"date":"2025-04-22T16:08:14","date_gmt":"2025-04-22T07:08:14","guid":{"rendered":"https:\/\/www.w-hec.com\/?page_id=1678"},"modified":"2025-05-21T12:02:22","modified_gmt":"2025-05-21T03:02:22","slug":"electronics","status":"publish","type":"page","link":"https:\/\/www.w-hec.com\/en\/industries\/electronics\/","title":{"rendered":"Electronic Components"},"content":{"rendered":"\r\n<div class=\"s-main_whiteBlock s-main_whiteBlock-big\">\r\n<div class=\"industries-sectionContainer\">\r\n<section id=\"content01\" class=\"industries-section\">\r\n<h2 class=\"c-borderTitle\">PCB<\/h2>\r\n<p>In the PCB industry, WHEC CIS line scan cameras are mainly used for comprehensive quality control applications including surface defect detection, hole integrity verification, component absence identification, foreign material detection, dimensional metrology, and optical character recognition (OCR) verification.<\/p>\r\n<p>Compared to conventional cameras, CIS line scan camera offers distinct advantages in the PCB inspection field, such as a compact design, easy assembly, 1:1 imaging, and no image distortion. A single CIS line scan camera can scan up to 3000mm without the need for image stitching. The 1:1 imaging capability ensures consistent defect imaging with a telecentric view, making it easier to trace defects across different process steps.<\/p>\r\n<div class=\"industries-imageBox\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/www.w-hec.com\/whec_wp\/wp-content\/themes\/whec\/assets\/img\/industries\/electronics_image01.webp\" alt=\"Photo: PCB\" width=\"1088\" height=\"800\" \/>\r\n<p class=\"industries-imageBox_note\">* Scanning Image with CIS<\/p>\r\n<\/div>\r\n<div class=\"industries-specBox\">\r\n<h3 class=\"c-normalTitle\">Technical Parameter<\/h3>\r\n<img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/www.w-hec.com\/whec_wp\/wp-content\/themes\/whec\/assets\/img\/industries\/electronics_spec01_en.webp\" alt=\"Technical specifications: PCB\" width=\"1060\" height=\"290\" \/><\/div>\r\n<\/section>\r\n<section id=\"content02\" class=\"industries-section\">\r\n<h2 class=\"c-borderTitle\">Wafer<\/h2>\r\n<p>In the Wafer industry, WHEC CIS line scan cameras are widely used for surface defects inspection, pattern inspection, outer profile detection, notchcing positioning, optical character recognition (OCR) verification, and etc.<\/p>\r\n<p>Compared to conventional cameras, CIS line scan camera offers distinct advantages in the wafer inspection field, such as a compact design, easy assembly, 1:1 imaging, and telecentric view without image distortion. The new GPL series delivers excellent imaging performance when scanning highly reflective wafers.<\/p>\r\n<div class=\"industries-imageBox\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/www.w-hec.com\/whec_wp\/wp-content\/themes\/whec\/assets\/img\/industries\/electronics_image02.webp\" alt=\"Photo: Wafer\" width=\"1088\" height=\"800\" \/>\r\n<p class=\"industries-imageBox_note\">* Scanning Image with CIS<\/p>\r\n<\/div>\r\n<div class=\"industries-specBox\">\r\n<h3 class=\"c-normalTitle\">Technical Parameter<\/h3>\r\n<img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/www.w-hec.com\/whec_wp\/wp-content\/themes\/whec\/assets\/img\/industries\/electronics_spec02_en.webp\" alt=\"Technical specifications: Wafer\" width=\"1060\" height=\"289\" \/><\/div>\r\n<\/section>\r\n<\/div>\r\n<div class=\"u-grid-jc-cnter\"><a class=\"c-button\" href=\"\/en\/industries\/\"> <span class=\"c-button_text\">View All Applications<\/span> <span class=\"c-button_arrow\">\u00a0<\/span> <\/a><\/div>\r\n<\/div>\r\n","protected":false},"excerpt":{"rendered":"<p>PCB In the PCB industry, WHEC CIS line scan cameras are mainly used for comprehensive quality control applicat [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":1667,"menu_order":42,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"_locale":"en_US","_original_post":"https:\/\/www.w-hec.com\/?page_id=1676","footnotes":""},"class_list":["post-1678","page","type-page","status-publish","hentry","en-US"],"acf":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.w-hec.com\/wp-json\/wp\/v2\/pages\/1678","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.w-hec.com\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.w-hec.com\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.w-hec.com\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.w-hec.com\/wp-json\/wp\/v2\/comments?post=1678"}],"version-history":[{"count":4,"href":"https:\/\/www.w-hec.com\/wp-json\/wp\/v2\/pages\/1678\/revisions"}],"predecessor-version":[{"id":2059,"href":"https:\/\/www.w-hec.com\/wp-json\/wp\/v2\/pages\/1678\/revisions\/2059"}],"up":[{"embeddable":true,"href":"https:\/\/www.w-hec.com\/wp-json\/wp\/v2\/pages\/1667"}],"wp:attachment":[{"href":"https:\/\/www.w-hec.com\/wp-json\/wp\/v2\/media?parent=1678"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}